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Adhesive bonding and performance testing of bonded wood productsAuthor(s): Charles R. Frihart
Source: Journal of ASTM International. Vol. 2, no. 7 (July/Aug. 2005): 10 pages.
Publication Series: Miscellaneous Publication
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DescriptionDespite the importance of durable wood bonds, the factors that lead to durability are not well understood, and the internal forces exerted upon the bondline are often overlooked. Durability requires that the bonded assembly resist dimensional changes of wood with fluctuation of wood moisture levels. Both bonding and bond breaking steps need to be understood at cellular and nanoscale, in addition to the larger spatial scales normally examined. With both internal and external forces being significant, interphase and bulk adhesive properties need to be better understood. Systematic studies of the bonding process, the forces upon the bondline, and the locus of failure using different types of adhesives and wood species should improve our ability to design wood adhesives. Modifications of wood surfaces, along with spectroscopic and microscopic analyses, are important tools to understand bond formation and failure.
CitationFrihart, Charles R. 2005. Adhesive bonding and performance testing of bonded wood products. Journal of ASTM International. Vol. 2, no. 7 (July/Aug. 2005): 10 pages.
KeywordsWood, bond formation, bond failure, cellular, microscopy
- What does moisture-related durability of wood bonds mean?
- Adhesive groups and how they relate to the durability of bonded wood
- Wood-adhesive bonding failure : modeling and simulation
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