Skip to Main Content
Due to a lapse in federal funding, this USDA website will not be actively updated. Once funding has been reestablished, online operations will continue.
In-situ cure monitoring of isocyanate adhesives using microdielectric analysisAuthor(s): Michael P. Wolcott; Timothy G. Rials
Source: Forest Products Journal, Vol. 45(2): 72-77
Publication Series: Miscellaneous Publication
PDF: View PDF (1.44 MB)
DescriptionRecent advances in microelectronics have produced small electrodes that can be used for remote dielectric measurements. These miniature sensors are small enought to be embedded in a composite panel during manufacture with little disturbance to the manufacturing process. Small particleboard panels (5 by 4.5 by 0.25 in) were manufactured with 6 percent polymeric diphenylmethane diisocyanate resin in a laboratory hot-press. A dielectric sensor was embedded in the core of each panel to measure both temperature and dielectric responses. The curing behavior of the particleboard furnish was also examined using dielectric analysis in a controlled oven and differential scanning calorimetry. Cole agreement was found between the curing response detected by both these techniques. In addition, the curing response of particleboard furnish in a controlled oven was remarkably similar to that seen in situ during particleboard manufacture using four different platen temperatures. The contribution of moisture changes during pressing to the dielectric signal was evaluated. Finally, two different sensor designs were evaluated on a limited basis.
- You may send email to email@example.com to request a hard copy of this publication.
- (Please specify exactly which publication you are requesting and your mailing address.)
- We recommend that you also print this page and attach it to the printout of the article, to retain the full citation information.
- This article was written and prepared by U.S. Government employees on official time, and is therefore in the public domain.
CitationWolcott, Michael P.; Rials, Timothy G. 1995. In-situ cure monitoring of isocyanate adhesives using microdielectric analysis. Forest Products Journal, Vol. 45(2): 72-77
- In-situ cure monitoring of isocyanate adhesives using microdielectric analysis
- Chemical and physical interpretation of MDI cure in saturated steam environments
- Volatile organic compound emissions during hot-pressing of southern pine particleboard : panel size effects and trade-off between press time and temperature
XML: View XML