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Nanoindentation methods for wood-adhesive bond linesAuthor(s): Joseph E. Jakes; Donald S. Stone; Charles R. Frihart
Source: Proceedings, 31st annual meeting of the Adhesion Society: February 17-20, 2008; Austin, TX. Blacksburg, VA : Adhesion Society, 2008:  pages.
Publication Series: Miscellaneous Publication
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DescriptionAs an adherend, wood is structurally, chemically, and mechanically more complex than metals or plastics, and the largest source of this complexity is wood’s chemical and mechanical inhomogeneities. Understanding and predicting the performance of adhesively bonded wood requires knowledge of the interactions occurring at length scales ranging from the macro down to the molecular level of chemical interactions. This work investigates such interactions occurring at and below the micrometer range using nanoindentation.
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CitationJakes, Joseph E.; Stone, Donald S.; Frihart, Charles R. 2008. Nanoindentation methods for wood-adhesive bond lines. Proceedings, 31st annual meeting of the Adhesion Society: February 17-20, 2008; Austin, TX. Blacksburg, VA : Adhesion Society, 2008:  pages.
KeywordsGlue, adhesion, adhesives, testing, gluing, wood chemistry, microstructure, nanotechnology, plant cell walls, nanostructured materials, ponderosa pine, wood anatomy, resorcinol, phenols, formaldehyde, phenolic resins, bonding, bond strength, bondline, nanoindentation, penetration, resorcinol glues
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