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    Author(s): Michael J. Birkeland; Linda Lorenz; James M. Wescott; Charles R. Frihart
    Date: 2010
    Source: Holzforschung. Vol. 64, no. 4 (June 2010): p. 429-433.
    Publication Series: Miscellaneous Publication
    PDF: View PDF  (195.72 KB)

    Description

    Hot-pressing wood, particularly in the production of wood composites, generates significant ‘‘native’’ (wood-based) formaldehyde (FA), even in the absence of adhesive. The level of native FA relates directly to the time and temperature of hot-pressing. This native FA dissipates in a relatively short time and is not part of the long-term FA emission issue commonly associated with hydrolyzing urea-formaldehyde bonds. This paper demonstrates that the common desiccator/ chromotropic acid method is very specific for FA and is not influenced by other volatile compounds set free from wood during hot-pressing. Furthermore, it is shown that particleboard produces native FA at high levels even in the absence of adhesives or in the presence of one type of no-added formaldehyde (NAF) adhesive. Soy-based adhesives suppress native FA emission and provide low FA emission levels in both the short and long term. This study highlights an often overlooked aspect that should be considered for emission testing: standardizing the time and conditions employed immediately after pressing and prior to the onset of emissions testing. Addressing this issue in more detail would improve the reliability of correlation between data obtained by rapid process monitoring methods and emission measurements in large chambers.

    Publication Notes

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    • This article was written and prepared by U.S. Government employees on official time, and is therefore in the public domain.

    Citation

    Birkeland, Michael J.; Lorenz, Linda; Wescott, James M.; Frihart, Charles R. 2010. Determination of native (wood derived) formaldehyde by the desiccator method in particleboards generated during panel production. Holzforschung. 64(4): 429-433.

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    Keywords

    Adhesives, environmental analysis, formaldehyde emission, no-added formaldehyde (NAF) adhesive, soy-based adhesives, wood adhesion, formaldehyde, particle board, heat treatment, soy flour, soybean glue, temperature, composite materials, hardboard, environmental monitoring, air pollution, measurement, desiccator method, bonding, chromotropic acid method, emissions, hot pressing, composite wood

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