Skip to Main Content
U.S. Forest Service
Caring for the land and serving people

United States Department of Agriculture

Home > Search > Publication Information

  1. Share via EmailShare on FacebookShare on LinkedInShare on Twitter
    Dislike this pubLike this pub
    Author(s): Zhiyong Cai
    Date: 2010
    Source: Wood Adhesives 2009 [electronic resource]. FPS proceedings no. 7216-09. Madison, WI : Forest Products Society, c2010 [1 CD-ROM]: p. 235-239: ISBN: 9781892529572: 1892529572.
    Publication Series: Miscellaneous Publication
    PDF: View PDF  (1.22 MB)

    Description

    The mechanism of wood bonding failure when exposed to wet conditions or wet/dry cycles is not fully understood and the role of the resulting internal stresses exerted upon the wood-adhesive bondline has yet to be quantitatively determined. Unlike previous modeling this study has developed a new two-dimensional internal-stress model on the basis of the mechanics of layered composites. Plywood panel is regarded as a multi-layered composite material where each layer (including bonding line) has different properties. When the plywood panel experiences moisture changes through its thickness, internal stresses and their corresponding strains develop among its layers. The model can be used to quantitatively simulate the relationship between the internal stresses and the panel parameters which include layer thickness, modulus of elasticity, linear expansion coefficient, Poisson’s ratio, shear modulus, density, and orientation of layers. The results may provide a better understanding of bonding failure during the water-exposure test. This paper describes the model development.

    Publication Notes

    • We recommend that you also print this page and attach it to the printout of the article, to retain the full citation information.
    • This article was written and prepared by U.S. Government employees on official time, and is therefore in the public domain.

    Citation

    Cai, Zhiyong. 2010. Wood-adhesive bonding failure : modeling and simulation. Wood Adhesives 2009 [electronic resource]. FPS proceedings no. 7216-09. Madison, WI : Forest Products Society, c2010 [1 CD-ROM]: p. 235-239: ISBN: 9781892529572: 1892529572.

    Keywords

    Plywood, moisture, adhesives, adhesion, glue, mechanical properties, gluing, strains, stresses, models, elasticity, engineering models, wood deterioration, deterioration, composite materials, modulus of elasticity, orientation, density, wood bonding, moisture content, flexibility, failure, bonding, durability, bond strength, failures in wood, bondline, Poisson's ratio, linear expansion coefficient

    Related Search


    XML: View XML
Show More
Show Fewer
Jump to Top of Page
https://www.fs.usda.gov/treesearch/pubs/37174