Skip to Main Content
Protein Modifiers Generally Provide Limited Improvement in Wood Bond Strength of Soy Flour AdhesivesAuthor(s): Charles R. Frihart; Linda Lorenz
Source: Forest Prod. J. Volume 63, Number 3/4: 2013; pp. 138–142.
Publication Series: Scientific Journal (JRNL)
Station: Forest Products Laboratory
View PDF (333.1 KB)
DescriptionSoy flour adhesives using a polyamidoamine-epichlorohydrin (PAE) polymeric coreactant are used increasingly as wood adhesives for interior products. Although these adhesives give good performance, higher bond strength under wet conditions is desirable. Wet strength is important for accelerated tests involving the internal forces generated by the swelling of wood and plasticization of the adhesive with increasing humidity.
- We recommend that you also print this page and attach it to the printout of the article, to retain the full citation information.
- This article was written and prepared by U.S. Government employees on official time, and is therefore in the public domain.
CitationFrihart, Charles R.; Lorenz, Linda. 2013. Protein Modifiers Generally Provide Limited Improvement in Wood Bond Strength of Soy Flour Adhesives. Forest Prod. J. Volume 63, Number 3/4: 2013; pp. 138–142.
KeywordsSoy, protein carbohydrate, adhesive, wood
- Specific oxidants improve the wood bonding strength of soy and other plant flours
- Chapter 8: Soy Properties and Soy Wood Adhesives
- High bonding temperatures greatly improve soy adhesive wet strength
XML: View XML