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    Author(s): Deep Panjwani; Mehmet Yesiltas; Janardan Nath; D.E. Maukonen; Imen Rezadad; Evan M. Smith; R.E. Peale; Carol Hirschmugl; Julia Sedlmair; Ralf Wehlitz; Miriam Unger; Glenn Boreman
    Date: 2014
    Source: Infrared Physics & Technology, Volume 62, 2014; pp. 94–99.
    Publication Series: Scientific Journal (JRNL)
    Station: Forest Products Laboratory
    PDF: Download Publication  (1.57 MB)


    A method to pattern infrared-absorbing gold black by conventional photolithography and lift-off is described. A photo-resist pattern is developed on a substrate by standard photolithography. Gold black is deposited over the whole by thermal evaporation in an inert gas at ~ 1 Torr. SiO2 is then deposited as a protection layer by electron beam evaporation. Lift-off proceeds by dissolving the photoresist in acetone. The resulting sub-millimeter size gold black patterns that remain on the substrate retain high infrared absorption out to ~5 μm wavelength and exhibit good mechanical stability. This technique allows selective application of gold black coatings to the pixels of thermal infrared imaging array detectors.

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    Panjwani, Deep; Yesiltas, Mehmet; Nath, Janardan; Maukonen, D.E.; Rezadad, Imen; Smith, Evan M.; Peale, R.E.; Hirschmugl, Carol; Sedlmair, Julia; Wehlitz, Ralf; Unger, Miriam; Boreman, Glenn. 2014. Patterning of oxide-hardened gold black by photolithography and metal lift-off. Infrared Physics & Technology, Volume 62, 2014; pp. 94–99.


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    Gold black, Pattering, MEMS, Photolithography, Infrared, Bolometer

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