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Flame Retardancy of Chemically Modified Lignin as Functional Additive to Epoxy NanocompositesAuthor(s): John A. Howarter; Gamini P. Mendis; Alex N. Bruce; Jeffrey P. Youngblood; Mark A. Dietenberger; Laura Hasburgh
Source: In: 26th annual Conference on Recent Advances in Flame retardancy, MAY 18 - 20, 2015 SHERATON STAMFORD HOTEL, STAMFORD CT USA; Session 3: Nanocomposites, 2015; pp. 2-1 - 2-8.
Publication Series: Full Proceedings
Station: Forest Products Laboratory
PDF: View PDF (940.95 KB)
DescriptionEpoxy printed circuit boards are used in a variety of electronics applications as rigid, thermally stable substrates. Due to the propensity of components on the boards, such as batteries and interconnects, to fail and ignite the epoxy, flame retardant additives are required to minimize fire risk. Currently, industry uses brominated flame retardants, such as TBBPA, to meet regulatory requirements1. However, recently, a number of environmental and human health issues have been raised about brominated compounds, so there is a desire to develop alternative flame retardant chemistries
CitationHowarter, John A.; Mendis, Gamini P.; Bruce, Alex N.; Youngblood, Jeffrey P.; Dietenberger, Mark A.; Hasburgh, Laura. 2015. Flame Retardancy of Chemically Modified Lignin as Functional Additive to Epoxy Nanocomposites. In: 26th annual Conference on Recent Advances in Flame retardancy, MAY 18 - 20, 2015 SHERATON STAMFORD HOTEL, STAMFORD CT USA; Session 3: Nanocomposites, 2015; pp. 2-1 - 2-8.
KeywordsCircuit Board epoxy, Phosphorus-based FRT, epoxy lignin composite, Mass Loss Calorimeter, TGA
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