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    Author(s): John A. Howarter; Gamini P. Mendis; Alex N. Bruce; Jeffrey P. Youngblood; Mark A. DietenbergerLaura Hasburgh
    Date: 2015
    Source: In: 26th annual Conference on Recent Advances in Flame retardancy, MAY 18 - 20, 2015 SHERATON STAMFORD HOTEL, STAMFORD CT USA; Session 3: Nanocomposites, 2015; pp. 2-1 - 2-8.
    Publication Series: Full Proceedings
    Station: Forest Products Laboratory
    PDF: View PDF  (940.95 KB)

    Description

    Epoxy printed circuit boards are used in a variety of electronics applications as rigid, thermally stable substrates. Due to the propensity of components on the boards, such as batteries and interconnects, to fail and ignite the epoxy, flame retardant additives are required to minimize fire risk. Currently, industry uses brominated flame retardants, such as TBBPA, to meet regulatory requirements1. However, recently, a number of environmental and human health issues have been raised about brominated compounds, so there is a desire to develop alternative flame retardant chemistries

    Publication Notes

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    • This article was written and prepared by U.S. Government employees on official time, and is therefore in the public domain.

    Citation

    Howarter, John A.; Mendis, Gamini P.; Bruce, Alex N.; Youngblood, Jeffrey P.; Dietenberger, Mark A.; Hasburgh, Laura. 2015. Flame Retardancy of Chemically Modified Lignin as Functional Additive to Epoxy Nanocomposites. In: 26th annual Conference on Recent Advances in Flame retardancy, MAY 18 - 20, 2015 SHERATON STAMFORD HOTEL, STAMFORD CT USA; Session 3: Nanocomposites, 2015; pp. 2-1 - 2-8.

    Keywords

    Circuit Board epoxy, Phosphorus-based FRT, epoxy lignin composite, Mass Loss Calorimeter, TGA

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https://www.fs.usda.gov/treesearch/pubs/48516