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Factors that lead to failure with wood adhesive bondsAuthor(s): Charles R. Frihart; James F. Beecher
Source: World Conference on Timber Engineering, WCTE 2016, August 22-25, 2016, Vienna, Austria.
Publication Series: Paper (invited, offered, keynote)
Station: Forest Products Laboratory
PDF: Download Publication (555.0 KB)
DescriptionUnderstanding what makes a good wood adhesive is difficult since the type of adhesive, wood species, bonding process, and resultant products vary considerably. Wood bonds are subjected to a variety of tests that reflect the different product performance criteria in diverse countries. The most common tests involve some type of moisture resistance; both wood and adhesive factors influence this moisture related failure. Models have been developed to explain the adhesive performance. The proper microscopic and spectroscopic techniques can lead to a better understanding of the failure mechanism so that improved adhesives can be designed and bonding processes can be optimized.
CitationFrihart, Charles R.; Beecher, James F. 2016. Factors that lead to failure with wood adhesive bonds. In: World Conference on Timber Engineering, WCTE 2016, 22-25 August 2016. Vienna, Austria. 8 pp.
Keywordswood, adhesive, failure, microscopy, spectroscopy, moisture, epoxy
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