Ability of finger-jointed lumber to maintain load at elevated temperatures

This article presents a test method that was developed to screen adhesive formulations for finger-jointed lumber. The goal was to develop a small-scale test that could be used to predict whether an adhesive would pass a full-scale ASTM E119 wall assembly test. The method involved loading a 38-mm square finger-jointed sample in a four-point bending test inside of an oven with a target sample temperature of 204°C. The deformation (creep) was examined as a function of time. It was found that samples fingerjointed with melamine formaldehyde and phenol resorcinol formaldehyde adhesives had the same creep behavior as solid wood. One-component polyurethane and polyvinyl acetate adhesives could not maintain the load at the target temperature measured middepth of the sample, and several different types of creep behavior were observed before failure. This method showed that the creep performance of the onecomponent adhesives may be quite different than the performance from short-term load deformation curves collected at high temperatures. The importance of creep performance of adhesives in the fire resistance of engineered wood is discussed.