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How overdrying wood reduces its bonding to phenol-formaldehyde adhesives : a critical review of the literature. Part I, Physical responsesAuthor(s): Alfred W. Christiansen
Source: Wood and fiber science. Vol. 22, no. 4 (1990): Pages 441-459
Publication Series: Miscellaneous Publication
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DescriptionThis review critically evaluates literature on the ways in which excessive drying (overdrying) inactivates wood surfaces to bonding, primarily for phenolic adhesives. In Part I of a two-part review, three inactivation mechanisms involving physical responses to overdrying are considered: (1) exudation of extractives to the surface, which lowers the wettability or hides the surface; (2) reorientation of wood surface molecules, which reduces wettability or places for bonding; and (3) irreversible closure of large micropores in cell walls. I believe that extensive evidence from wood bonding and paper sizing research supports the mechanism of extractives-induced low wettability as the cause for inactivation of Douglas-fir and southern pines. Molecular reonentation and irreversible micropore closure are proposed wood inactivation mechanisms that involve loss of wettability and bonding sites.
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CitationChristiansen, Alfred W. 1990. How overdrying wood reduces its bonding to phenol-formaldehyde adhesives : a critical review of the literature. Part I, Physical responses. Wood and fiber science. Vol. 22, no. 4 (1990): Pages 441-459
KeywordsDrying, inactivation, adhesive, bonding, review, extractives, mechanism, wettability
- How overdrying wood reduces its bonding to phenol-formaldehyde adhesives : a critical review of the literature. Part II, Chemical reactions
- Influence of extractives on wood gluing and finishing- a review
- Effect of log soaking and the temperature of peeling on the properties of rotary-cut birch (Betula pendula Roth) veneer bonded with phenol-formaldehyde adhesive
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