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Evaluation of the cure kinetics of the wood/pMDI bondlineAuthor(s): David P. Harper; Michael P. Wolcott; Timothy G. Rials
Source: International Journal of Adhesion and Adhesives 21 (2001) 137-144
Publication Series: Miscellaneous Publication
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DescriptionMicro-dielectric analysis (µDEA) and differentia1 scanning calorimetry (DSC) were used to monitor cure of polymeric diphenyl-methane diisocyanate (pMDI) resin with wood strands in a saturated steam environment. A first-order autocatalyzed kinetic model was employed to determine kinetic parameters. The kinetics were found to follow an Arrhenius relation. A single ramp DSC technique and µDEA produced models that predicted similar results at higher cure temperatures, but the µDEA-based model predicts a longet cure time at low temperatures. The isothermal µDEA method yields higher activation energies and Arrhenius frequency factors than models based on single DSC ramps. A modification to ASTM E698 was made to conform to the assumption of autocatalyzed kinetics. The modified ASTM E698 method predicted an earlier end of cure than the µDEA-based models and was in agreement with DSC results obtained by partial cure experiments. The activation energies and frequency factors for the different cure monitoring methods are sensitive to different stages of cure.
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CitationHarper, David P.; Wolcott, Michael P.; Rials, Timothy G. 2001. Evaluation of the cure kinetics of the wood/pMDI bondline. International Journal of Adhesion and Adhesives 21 (2001) 137-144
KeywordsB. wood, polymeric isocyanate, cure kinetics, dielectric analysis
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