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Specific adhesion model for bonding hot-melt polyamides to vinyl

Hot-melt polyamides are an important market for the dimer acid made from the tall oil fatty acids liberated during the Kraft pulping process. These polyamides bond well to many substrates, but not to polyvinyl chloride (PVC), commonly called vinyl. Dimer-based polyamides made from secondary amines such as piperazine bond well to vinyl. No model for this unique adhesion...

Author(s):

Charles R. Frihart

Year:

2004

Keywords:

Polyamide, hot-melt, adhesive, polyvinyl chloride, model, adhesion, rheology, solubility parameter, acid-base, poly(ester-amide), hydrogen bond, piperazine

Source:

International journal of adhesion & adhesives. Vol. 24 (2004): Pages 415-422

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Specific adhesion model for bonding hot-melt polyamides to vinyl

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